Method and device for processing substrate

ABSTRACT

A substrate processing method comprises stopping the transfer of a head substrate of a succeeding lot for a period which is an integral multiple of a cycle time after a last substrate of a preceding lot is transferred from a cassette section to a processing section by a transfer mechanism, executing dummy dispense of a predetermined time by a solution processing unit during the substrate transfer stop period, and transferring the head substrate of the succeeding lot to the processing section by the transfer mechanism after the dummy dispense.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is based upon and claims the benefit of priorityfrom the prior Japanese Patent Application No. 2002-129976, filed May 1,2002, the entire contents of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a method and a device forprocessing a substrate which are used in photolithography for forming apredetermined circuit pattern on a substrate for a semiconductor waferor a liquid crystal display (LCD).

[0004] 2. Description of the Related Art

[0005] The substrate processing device is disclosed in, for example,U.S. Pat. No. 6,444,029B1. Operations of a main carrying mechanism and asemiconductor wafer in the conventional device will be described byreferring to FIG. 1. Two main carrying mechanisms 15A, 15B cooperativelycarry a wafer W in a sequence of a cassette stage 11→a TRS1→a CPL1→acoating unit (COT)→a TRS2→an LHP1→a CPL2→an interface section 1B on anapproach route. Then, the main carrying mechanisms 15A, 15B turn aroundto change directions, and cooperatively carry the wafer W in a sequenceof the interface section 1B→a PEB→a CPL3→a developing unit (DEV)→anLHP2→a TRS3→a TRS4→the cassette stage 11 on a return route. The TRS1,TRS4 are transfer units to transfer the wafer between an auxiliarycarrying mechanism (not shown) and the main carrying mechanism 15A. TheTRS2, TRS3 are transfer units to transfer the wafer between the maincarrying mechanisms 15A, 15B.

[0006] One main carrying mechanism 15A moves along a cyclic route of theTRS1→the CPL1→the coating unit (COT)→the TRS2→the TRS3→the TRS4→the TRS1in a processing section 1A. One round of the main carrying mechanism 15Aalong this cyclic route is called “one cycle movement of the maincarrying mechanism 15A”. The other main carrying mechanism 15B movesalong a cyclic route of the TRS2→the LHP1→the CPL2→the PEB→the CPL3→thedeveloping unit (DEV)→the LHP2→the TRS3→the TRS2 in the processingsection 1A. One round of the main carrying mechanism 15B along thiscyclic route is called “one cycle movement of the main carryingmechanism 15B”. Operations of the main carrying mechanisms ISA, 15Bduring the cycle movements are controlled by a predetermined program ofa control section, and forward movements and stopping are repeatedwithout any backtracking on the cyclic routes.

[0007] Each of the main carrying mechanisms 15A, 15B comprises two upperand lower arms to load/unload the wafer W on a processing unit. Forexample, the main carrying mechanism 15A receives an n-th wafer Wn fromthe TRS1, and carries it to the CPL1 of a next step. Then, the mechanismISA makes one cycle movement along the cyclic route, and returns to theTRS1 to receive a next (n+1)-th wafer W(n+1) therefrom.

[0008] Thus, for each one cycle movement of the main carrying mechanism15A, wafers W are carried one by one from the cassette section 11 intothe processing section 1A through the TRS1. Further, for each one cyclemovement of the main carrying mechanism 15A, the wafers W are carriedone by one from the processing section 1A out to the cassette section 11through the TRS4.

[0009] On the other hand, for each one cycle movement of the maincarried mechanism 15B, the wafers W are transferred one by one to theinterface section 1B through the CPL1. Further, for each one cyclemovement of the main carrying mechanism 15B, the wafers W are receivedone by one from the interface unit 1B through the PEB unit. Bysequentially repeating these operations, a predetermined process iscarried out for all the wafers of lots.

[0010] For example, at the coating unit (COT), a resist is spin-coatedon the wafer W. At this time, a resist solution in a tank is fed bypressure through a pump to a supply line, and then supplied through thesupply line into a nozzle. Here, if supply of the resist solution to thewafer W is stopped, the resist solution stays in the nozzle or thesupply line for a long time, which changes the properties (mainly, thesolvent volatilizes, which changes the resist viscosity). Thus, betweena preceding lot and a succeeding lot, i.e., while the resist is notcoated on the wafer W, a so-called dummy dispense is carried out todischarge the staying resist solution from the nozzle or the supplyline. This dummy dispense is similarly carried out in the developingunit (DEV).

[0011] As described above, the main carrying mechanisms 15A, 15B onlymove forward or stop without backtracking on the cyclic routes. In thiscase, if the dummy dispense is carried out at the coating unit (COT),the main carrying mechanism 15A stops at the coating unit (COT) to beset on standby until the dummy dispense is finished. Similarly, if thedummy dispense is carried out at the developing unit (DEV), the othermain carrying mechanism 15B stops at the developing unit (DEV) to be seton standby.

[0012] Now, explanation is made by taking an example of carrying out thedummy dispense at the coating unit (COT) between a preceding lot A (1lot: 25 wafers) and a succeeding lot B. When resist coating is finishedon a last wafer A25 of the preceding lot A, the main carrying mechanism15A takes out a head wafer B01 of the succeeding lot B from the CPL1 ofa previous step by one arm, and the wafer A25 from the coating unit(COT) by the other arm.

[0013] On the other hand, there is a wafer A24 of the preceding lot A inthe TRS2 of a next step of the coating unit (COT). This wafer A24 iscarried to the LHP1 of a next step by the other main carrying mechanism15B. Accordingly, after the wafer A24 is taken out from the TRS2, themain carrying mechanism 15A transfers the wafer A25 to the TRS2 by theother arm.

[0014] Subsequently, one arm of the main carrying mechanism ISAtransfers the wafer B01 to the coating unit. However, if the dummydispense is carried out at the coating unit (COT), since the wafer B01cannot be carried into the coating unit (COT), the main carryingmechanism 15A is set on standby while holding the wafer B01. Therefore,carrying of the wafer B01 by the main carrying mechanism 15A stops.

[0015] Even if the main carrying mechanism 15A carries the wafer B01into the coating unit (COT) before the dummy dispense, finally the maincarrying mechanism ISA stops during the execution of the dummy dispenseor the coating of the resist solution on the wafer B01. Thus, thestopping time of the main carrying mechanism 15A becomes longer by anamount necessary for the dummy dispense at the coating unit (COT). Thesame occurs in the main carrying mechanism 15B when the dummy dispenseis carried out at the developing unit (DEV). On the whole, therefore,transfer of the wafer W is not smooth between the main carryingmechanisms 15A, 15B in the processing section 1A, which impedesimprovement of throughput.

BRIEF SUMMARY OF THE INVENTION

[0016] An object of the present invention is to provide a method and adevice for processing a substrate, which can smoothly transfer thesubstrate among a plurality of main carrying mechanisms to improvethroughput even when dummy dispense is carried out at a solutionprocessing unit (resist coating unit, developing unit, BARC coating unitor the like).

[0017] A substrate processing method of the present invention comprises:transferring substrates one by one from a cassette section to aprocessing section by a transfer mechanism at timing of eachpredetermined cycle time, the cassette section having a cassette whichhouses a plurality of substrates constituting lots, the processingsection including a plurality of solution processing units and aplurality of substrate carrying mechanisms; carrying the substrates insequence along a cyclic route of the processing section by the substratecarrying mechanisms; executing a plurality of processes for thesubstrates in sequence; carrying the processed substrates from theprocessing section to the cassette section; and executing dummy dispenseby at least one of the solution processing units in a period between aprocess of a preceding lot substrate and a process of a succeeding lotsubstrate, and the method is characterized by comprising:

[0018] (i) stopping the transfer of a head substrate of the succeedinglot for a period which is an integral multiple of the cycle time, aftera last substrate of the preceding lot is transferred from the cassettesection to the processing section by the transfer mechanism;

[0019] (ii) executing dummy dispense of a predetermined dummy dispensetime by the solution processing unit during the substrate transfer stopperiod; and

[0020] (iii) transferring the head substrate of the succeeding lot tothe processing section by the transfer mechanism after the dummydispense.

[0021] The substrate processing method of the present invention furthercomprises: (iv) making a recipe to control an operation of each of thetransfer mechanism, the substrate carrying mechanisms and the solutionprocessing units and a recipe to define initial conditions, and storingthe made recipes; (v) selecting the necessary recipe from the storedrecipes; (vi) setting the cycle time and the dummy dispense time basedon the selected recipe; (vii) obtaining the substrate transfer stopperiod based on the cycle time and the dummy dispense time; and (viii)controlling operations of the transfer mechanism, the substrate carryingmechanisms and the solution processing units by using the substratetransfer stop period, the cycle time and the dummy dispense time,thereby causing at least one of the solution processing units to executethe dummy dispense during the substrate transfer stop period.

[0022] A substrate processing device of the present invention comprises:

[0023] a cassette section from and into which a cassette housing aplurality of substrates constituting lots is taken and put;

[0024] a processing section to execute a plurality of processes for thesubstrates in sequence;

[0025] a plurality of solution processing units disposed in theprocessing section to process the substrates by using a predeterminedprocessing solution;

[0026] a transfer mechanism to take out the substrates from the cassetteof the cassette section and to transfer the substrates to the processingsection;

[0027] substrate carrying mechanisms to receive the substrates from thetransfer mechanism, to carry the substrates in sequence in theprocessing section, and to carry the substrates out to the cassettesection;

[0028] a cyclic route disposed in the processing section, along whichthe substrate carrying mechanisms make cycle movements; and

[0029] a control section to make recipes which define operations of thetransfer mechanism, the substrate carrying mechanisms and the solutionprocessing units, to obtain a cycle time and a dummy dispense time basedon the recipes, to obtain a substrate transfer stop period based on therecipes, the cycle time and the dummy dispense time, to stop transfer ofa substrate of a succeeding lot from the cassette section to theprocessing section during the substrate transfer stop period, to causethe solution processing unit to execute dummy dispense during thesubstrate transfer stop period, and then to transfer the substrate ofthe succeeding lot to the processing section by the transfer mechanism.

[0030] The control section comprises: a recipe making section to make arecipe to define an operation of each of the transfer mechanism, thesubstrate carrying mechanisms and the solution processing units; arecipe storing section to store the recipes made by the recipe makingsection; a recipe selecting section to select and call the recipesstored in the recipe storing section; a cycle time calculating sectionto calculate the cycle time based on the recipes; a dummy dispensecalculating section to calculate the dummy dispense time based on therecipes; a transfer stop period calculating section to calculate thesubstrate transfer stop period based on the recipes, the cycle time andthe dummy dispense time; a counting section to count the number of theprocessed substrates; and a dummy dispense determining section to decideexecution timing of the dummy dispense based on the counted number ofthe processed substrates and the transfer stop period.

[0031] According to the present invention, since the transfer ofsubstrates from the cassette section to the processing section isstopped for the predetermined period and, during this stop period, thedummy dispense is executed by the solution processing unit, nosubstrates stay on the cyclic route. Therefore, it is possible toprevent overbaking of a resist film in a heating device caused by, forexample, delayed taking-out of the substrate from the heating device.

[0032] Here, the “cycle time” is a time for each of the substratecarrying mechanisms (main carrying mechanisms) to make a round along thecyclic route and return to a starting point irrespective of substrateholding. In other words, the “cycle time” is from transfer of an n-thsubstrate in the cassette from the transfer mechanism to the substratecarrying mechanism to transfer of a next (n+1)-th substrate in thecassette from the transfer mechanism to the substrate carrying mechanismin the case where the substrate is held.

[0033] The “dummy dispense time” is a sum total of a discharging anddisposing time of a process solution from the nozzle and nozzleoperation time in the solution processing unit.

[0034] The “process of the substrates in sequence” is execution of apreceding process for the substrates first and then execution of asucceeding process in order defined by predetermined recipes. This meansthat a process of substrates outside the order defined by apredetermined process recipe is not included, for example, no reversaloccurs in order between the preceding process and the succeeding processin the processing section.

[0035] The “carrying of the substrates in sequence” is forward-directioncarrying of the substrates by advancing and stopping of the substratecarrying mechanism repeated in order defined by predetermined recipes.This means that carrying of substrates outside the order defined by apredetermined carrying recipe is not included, for example, thesubstrate carrying mechanism does not backtrack in the processingsection to carry the substrates in a backward direction.

[0036] The “substrate transfer stop period” is a period for stopping thetransfer of the substrates from the cassette section to the processingsection. In other words, this period is equivalent to a period of notransfer of substrates by the transfer mechanism to the substratecarrying mechanism, i.e., an empty cycle carrying period where thesubstrate carrying mechanism moved along the cyclic route for a timewhich is an integral multiple of the cycle time in a state of holding nosubstrates. This period (number of empty cycle times) is calculatedbased on the cycle time and the dummy dispense time given bypredetermined recipes. For example, if the cycle time is A seconds andthe dummy dispense time is B seconds, first, an integer x (including 0)which satisfies a relation of an inequality Axx<B is obtained. Then, 1is added to the integer x to obtain (x+1). This integer (x+1) isequivalent to the number of wafer transfer stopping times. If the cycletime is multiplied by the integer (x+1), a substrate transfer stopperiod is obtained.

[0037] Incidentally, an operator may predict the dummy dispense timebased on the stored recipes, and decide the substrate transfer stopperiod based on the predicted dummy dispense time.

[0038] The execution timing of the dummy dispense is controlled by usingone of an interval between lots, a time interval between lots and aminimum wafer count. Further, the execution timing of the dummy dispensemay be set to a process recipe change timing.

[0039] The number of the continuously processed substrates after theprevious dummy dispense is counted, and based on the counted number, itcan be determined whether or not the next dummy dispense is executed. Inthis case, the number of the continuously processed substrates can becounted at the processing section or the cassette section.

[0040] A continuous processing time of the substrates is counted afterthe previous dummy dispense, and based on the counted time, it can bedetermined whether or not the next dummy dispense is executed.

[0041] A place of the last substrate of the preceding lot in theprocessing section is detected, and based on a result of the detection,it can be determined whether or not the next dummy dispense is executed.

[0042] Further, in order to detect a step in which the last substrate ofthe preceding lot and the head substrate of the succeeding lot arepresent, the substrates actually flowing in the processing section arecounted, and based on a result of the counting, it is determined whetheror not the next dummy dispense is executed.

[0043] In order to prevent adverse effects of mist or vapor of thesolution discharged during the dummy dispense, preferably, the dummydispense is executed while there are no substrates in the coating unitor the developing unit.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING

[0044]FIG. 1 is a schematic plan view showing a substrate carrying routein a conventional device.

[0045]FIG. 2 is a plan view showing a substrate processing device inoutline.

[0046]FIG. 3 is a perspective view showing the substrate processingdevice in outline.

[0047]FIG. 4 is a schematic side view showing a shelf unit portion ofthe substrate processing device.

[0048]FIG. 5 is a schematic plan view showing a substrate carrying routein a device of the present invention.

[0049]FIG. 6 is a schematic sectional view showing a coating deviceportion of the substrate processing device.

[0050]FIG. 7 is a control block diagram showing a control section and acontroller of each section of the substrate processing device.

[0051]FIG. 8 is a conceptual view showing a recipe storage section ofthe control section.

[0052]FIG. 9 is a timing chart schematically showing execution timing ofdummy dispense.

[0053]FIG. 10A is a diagram showing an embodiment of a method of thepresent invention (dummy dispense is inserted once).

[0054]FIG. 10B is a diagram showing another embodiment of a method ofthe present invention (dummy dispense is inserted twice).

[0055]FIGS. 11A and 11B are flowcharts of control processed by softwarein a computer before the computer issues a dummy dispense executioncommand to the controller of each section.

[0056]FIG. 12 is a block conceptual diagram explaining a main functionconcerning a dummy dispense recipe.

[0057]FIG. 13 is a schematic view showing an example of an edit screenof the dummy dispense recipe.

[0058]FIG. 14 is a schematic view showing an example of a screen ofsetting a dummy dispense operation sequence.

DETAILED DESCRIPTION OF THE INVENTION

[0059] First, description will be made in outline of an example of asubstrate processing device where a substrate processing method of thepresent invention is implemented. As shown in FIGS. 2, 3, the substrateprocessing device comprises a cassette station 21, an auxiliary carryingmechanism 24, two main carrying mechanisms 26A, 26B, a processingsection S1, a first interface section S2, a second interface section S3,and a control section 6. The cassette station 21 has a mounting section22. In the mounting section 22, a maximum of four cassettes C aremounted at equal pitches along a Y axis. The cassette C is ahermetically sealed housing type having a cap to be opened/closed, inwhich a maximum of thirteen wafers W of, e.g., 12 inches, are housed.

[0060] An opening/closing section 23 is disposed on a front wall surfaceseen from the mounting section 22, and the auxiliary carrying mechanism24 is disposed to take out the wafer W from the cassette C through theopening/closing section 23. This auxiliary carrying mechanism 24 isconstituted so that an arm can be freely moved up and down, left andright, and back and forth and rotated around a vertical axis. Drivingthereof is controlled by a controller 40 (see FIG. 6) based on a commandfrom the control section 6.

[0061] The processing section S1 surrounded with a casing is connectedto a deep side of the cassette station 21. In this processing sectionS1, sequentially from a front side, three shelf units 25 (25A, 25B, 25C)where a heating/cooling system unit is multistaged, and two maincarrying mechanisms 26 (26A, 26B) for transferring the wafer W betweenlater-described solution processing units are alternately arrayed. Eachof the main carrying mechanisms 26 (26A, 26B) comprises, for example,two arms 27. It is constituted so that the arm 27 can be freely moved upand down, left and right, and back and forth and rotated around thevertical axis. Driving thereof is controlled by the controller 40 (seeFIG. 6) based on a command from the control section 6.

[0062] The shelf units 25 (25A, 25B, 25C) and the main carryingmechanisms 26 (26A, 26B) are arrayed in rows back and forth when seenfrom the cassette station 21 side, and a not-shown opening for wafercarrying is formed in each connection portion G. Thus, in the processingsection S1, the wafer W can be freely moved from the shelf unit 25A ofone end to the shelf unit 25C of the other end.

[0063] The main carrying mechanisms 26 (26A, 26B) are placed in a spacesurrounded with a partition wall constituted of one surface of the shelfunit 25 (25A, 25B, 25C) side arranged back and forth when seen from thecassette station 21, and a rear constituting, for example, one surfaceof the solution processing device of a right side and one surface of aleft side.

[0064] In portions of the main carrying mechanisms 26A, 26B to which theshelf units 25A, 25B, 25C are not connected, e.g., in the aforementionedright side surfaces, solution processing units 28A, 28B where solutionprocessing devices such as a coating device 4A and a developing device4B are multistaged are disposed. In each of these solution processingunits 28A, 28B, as shown in FIG. 3, a plurality of stages (e.g., 5stages) of processing containers 29 are laminated to house the coatingdevice 4A or the like. On the side face of each of the processingcontainers 29 in the substrate carrying means side, a carrying port 29 ais formed to enable entry of the arm 27 during carrying in/out of thewafer W, and a not-shown shutter is disposed in the carrying port 29 a.

[0065] As shown in FIG. 4, the shelf units 25A, 25B, 25C comprise aplurality of transfer units TRS1, TRS2, TRS3, TRS4, a plurality ofheating units LHP1, LHP2, and a plurality of cooling units CPL1, CPL2,CPL3. Each of the transfer units TRS1 to TRS4 comprises a transfer baseto transfer the wafer. The heating units LHP1, LHP2 heat the wafer afterresist coating or developer solution coating. The cooling units CPL1,CPL2, CPL3 cool the wafer before/after the resist coating or beforedevelopment. For example, ten stages of heating units (PEB) areallocated up and down. Here, the TRS1, TRS4 are used to transfer thewafer between the cassette station 21 and the processing section S1. TheTRS2, TRS3 are used to transfer the wafer between the main carryingmechanisms 26A, 26B.

[0066] According to the embodiment, the transfer units TRS1, TRS2, TRS3,TRS4, the heating units LHP1, LHP2, the cooling units CPL1, CPL2, CPL3,the heating units PEB and the heating units are equivalent to“processing units”. The transfer units TRS1, TRS4, the heating unitsPEB, and the auxiliary carrying mechanism 24 are equivalent to “transfermechanisms”. The transfer units TRS1 to TRS4 may be used not only forsubstrate transfer but also for substrate heating/cooling.

[0067] An exposure device S4 is connected to a deep side of the shelfunit 25C in the processing section S1 through the first interfacesection S2 and the second interface section S3. The first interfacesection S2 comprises an auxiliary carrying mechanism 31 constituted tobe freely moved up and down and rotated around the vertical axis and totransfer the wafer to the CPL2 or the PEB of the shelf unit 25C of theprocessing section S1 as described later, a shelf unit 32A where anin-buffer cassette for temporarily storing the wafer carried into aperipheral exposure device and the exposure device S4 and an out-buffercassette for temporarily storing the wafer carried out from the exposuredevice S4 are arranged at multiple stages, and a shelf unit 32B where awafer transfer unit and a highly accurate air conditioning unit arearranged at multiple stages.

[0068] In the second interface section S3, an auxiliary carryingmechanism 33 is disposed so as to be freely moved roughly horizontallyand up and down, and rotated around the vertical axis, whereby the waferis transferred to the transfer unit and the highly accurate airconditioning unit of the first interface section S1, and an in-stage 34and an out-stage 35 of the exposure device S4.

[0069] Next, movements of the main carrying mechanisms 26A, 26B in theprocessing section S1 will be described. As shown in FIG. 5, the twomain carrying mechanisms 26A, 26B move to carry the wafer W from thecassette station 21 to the first interface section S2 in sequence of theTRS1→the CPL1→the coating unit→the TRS2→the LHP1→the CPL2, and then tocarry the wafer from the first interface section S2 to the cassettestation 21 in sequence of the PEB→the CPL3→the developing device(DEV)→the LHP2→the TRS3→the TRS4. Between the processing section S1 andthe first interface section S2, the wafer W is transferred through heCPL2 and the PEB.

[0070] As indicated by a broken line in FIG. 5, one main carryingmechanism 26A carries the wafer W in a sequence of the TRS1→the CPL1→theCOT→the TRS2→the TRS3→the TRS4→the TRS1. The other main carryingmechanism 26B carries the wafer W in a sequence of the TRS2→the LHP1→theCPL2→the PEB→the CPL3→the DEV→the LHP2→the TRS3→the TRS2. Thus, as shownin FIG. 4, the TRS1, TRS4 are arranged in the shelf unit 25A, the TRS2,TRS3 are arranged in the shelf unit 25B, the CPL2 and the PEB arearranged in the shelf unit 25C, the CPL1 is arranged in the shelf unit25A or 25B, and the LHP1, LHP2 are arranged in the shelf unit 25B or25C.

[0071] A flow of the wafer in the device will be described. First, whenthe cassette C housing the wafer W is carried from the outside into thecassette station 21, the cap of the cassette C is removed together withthe opening/closing section 23, and the wafer W is taken out by theauxiliary carrying mechanism 24. Then, the wafer W is transferred fromthe auxiliary carrying mechanism 24 to the main carrying mechanism 26Athrough the transfer unit (TRS1) which is one component of the shelfunit 25A. Subsequently, the wafer W is carried in a sequence of theTRS1→the CPL1→the COT→the TRS2→the LHP1→the CPL2 by the main carryingmechanisms 26A, 26B, and the wafer on which the resist solution iscoated is sent to the first interface section S2 through the CPL2.

[0072] In the first interface section S2, the wafer is carried in asequence of the in-buffer cassette→the peripheral exposure device→thehighly accurate air conditioning unit by the auxiliary carryingmechanism 31, carried to the second interface section S3 through thetransfer unit of the shelf unit 32B, and then carried by the auxiliarycarrying mechanism 33 of the second interface section S3 to the exposuredevice S4 through the in-stage 34 of the exposure device S4 to beexposed.

[0073] The exposed wafer is carried through the second interface sectionS3→the first intersection section S2 to the processing section S1through the PEB of the processing section S1, and then carried in asequence of the PEB→the CPL3→the DEV→the LHP2→the TRS3→the TRS4.

[0074] The first main carrying mechanism 26A carries an n-th wafer W ofthe lot to the CPL1 of a next step through the TRS1, then passes throughin a sequence of the COT→the TRS2→the TRS3→the TRS4→the TRS1, andreturns to the TRS1 (1 cycle) to carry a next (n+1)-th wafer Wn+1 to theCPL1 through the TRS1. During this one cycle, the second main carryingmechanism 26B carries the wafer of the TRS2 to the LHP1 of a next step,and then returns to the TRS2 again after one cycle on a route of theCPL2→the PEB→the CPL3→the DEV→the LHP2→the TRS3→the TRS2 to carry a nextwafer to the LHP1 through the TRS2.

[0075] Now, the coating device 4A shown in FIG. 6 will be described. Aspin chuck 41 can be rotated roughly around the vertical axis by adriving section 42 including a motor and an elevation section, and movedup and down. Around the spin chuck 41, a solution receiving cup 43 isdisposed to cover a portion from the wafer W over the spin chuck 41, inwhich a recess is formed all around the periphery of a lower side. Anexhaust pipe 44 and a drain pipe 45 are connected to a bottom surface ofthe solution receiving cup 43.

[0076] A resist solution supply nozzle 46 is disposed in an upper sideof the solution receiving cup 43. This supply nozzle 46 is moved betweena part above a center of the wafer W and a standby section 48 outsidethe solution receiving cup 43 by a not-shown moving mechanism. Thesupply nozzle 46 is communicated and connected through a supply route 49having a pump P and a valve V set up to feed the resist solution intothe nozzle 46 by pressure to a resist solution tank 50 which is a resistsolution supply source.

[0077] In the standby section 48, a cleaning tank 51 is disposed tostore thinner as a cleaning solution. This cleaning tank 51 comprises acleaning solution supply pipe 52 for supplying the cleaning solutioninto the cleaning tank 51, and a discharge pipe 53 for discharging thecleaning solution or the like from the cleaning tank.

[0078] In the standby section 48, during dummy dispense, the resistsolution is discharged from the supply nozzle 46 into the cleaning tank51, and the discharged resist solution is discharged from the dischargepipe 53. While the supply nozzle 46 is on standby, the nozzle 46 isdipped in the cleaning tank 51, to be cleaned by the cleaning solution.

[0079] The main carrying mechanism 26A carries the wafer W into such acoating device 4A, and the wafer W is transferred to the spin chuck 41.Then, a resist is spin-coated on the wafer W. At this time, operationsof the driving section 42, the valve V and the pump P are controlled bythe controller 40. Conditions including timing of a start or stop of theoperation of the driving section 42, opening/closing of the valve V, andthe operation of the pump P, a rotational speed of the spin chuck 41,the amount of the discharged resist solution etc. are set by thelater-described control section 6, and a command is issued from thecontrol section 6 to the controller 40A.

[0080] Next, the control section 6 will be described by referring toFIG. 7.

[0081] The control section 6 makes and manages a recipe for eachprocessing unit, and controls each processing unit in accordance withthe recipe. The control section 6 comprises a recipe making section 61,a recipe storing section 62, a recipe selecting section 63, a cycle timecalculating section 64, a dummy dispense time calculating section 65, atransfer stopping times calculating section 66, a counting section 67,and a dummy dispense determining section 68. These sections 61 to 68 areinterconnected through a system bus B1.

[0082] Further, the control section 6 is connected to controllers 260,240, 40A, 40B, 540 in order to send control signals to the main carryingmechanisms 26A, 26B, the auxiliary carrying mechanism 24, the coatingdevice 4A, the developing device 4B, and a heating/cooling system unit54 such as the CPL, the LHP or the PEB disposed in each of the shelfunits 25A to 25C.

[0083] In the recipe making section 61, a process recipe can be entered,which combines processing conditions, such as kind of resist anddeveloper solution, a heating temperature and time, a coolingtemperature and time, a coating time of a resist solution, a developingtime, timing of the dummy dispense, and the number of wafers per lot.This recipe making section 61 includes a plurality of edit screens shownin FIGS. 13 and 14. Each recipe made by the recipe making section 61 isstored in the recipe storing section 62.

[0084] As shown in FIG. 8, the recipe storing section 62 stores aprocess recipe 71, a wafer carrying recipe 72, a pump recipe 73, a dummydispense recipe 74 etc.

[0085] In the recipe selecting section 63, based on data which anoperator enters on an operation screen in accordance with a targetprocess, selection is made from the process recipe 71, the carryingrecipe 72, the pump recipe 73 and the dummy dispense recipe 74.

[0086] The cycle time calculating section 64 has a function ofcalculating a cycle time of the main carrying mechanism 26A for carryingthe wafer to the coating unit COT according to the embodiment. Here, the“cycle time” means a time from transfer of the n-th wafer in thecassette C of the cassette station 21 to the main carrying mechanism 26Ato transfer of a next (n+1)-th wafer to the main carrying mechanism 26A.Specifically, it means a time from a point when the main carryingmechanism 26A receives the n-th wafer transferred from the cassette C tothe TRS1 of the processing section S1 by the auxiliary carryingmechanism 24 to a point when the main carrying mechanism 26A moves alonga predetermined route in the processing section S1 to receive the(n+1)-th wafer transferred again from the cassette station 21 to theTRS1. This cycle time is calculated based on the process recipe 71 andthe carrying recipe 72 selected by the recipe selecting section 63. Thecycle time is set to, for example, 30 seconds.

[0087] The dummy dispense time calculating section 65 f has a functionof calculating a dummy dispense time in the coating device. The dummydispense time is calculated based on the pump recipe 73 and the dummydispense recipe 74 selected by the recipe selecting section 63. Thedummy dispense time is set to, for example, 20 seconds (or 40 seconds).

[0088] The wafer transfer stopping times calculating section 66 has afunction of calculating, in the case of carrying out the dummy dispensebetween a preceding lot and a succeeding lot in the solution processingunit, the number of times of stopping the transfer of a first wafer B01of the succeeding lot to the substrate carrying means after a last wafer25A of the preceding lot of the cassette station 21 is transferred tothe main carrying mechanism 26A.

[0089] According to the embodiment, the “wafer transfer stop period(number of cycles)” means a period of stopping the transfer of the waferfrom the cassette station 21 to the TRS1 (number of cycles). This period(number of cycles) is calculated based on a cycle time and a dummydispense time given by predetermined recipes. For example, if the cycletime is A seconds and the dummy dispense time is B seconds, first, aninteger x (including 0), which satisfies a relation of an inequalityAxx<B, is obtained. Then, 1 is added to the integer x to obtain (x+1).This (x+1) becomes the number of times of stopping wafer transfer, i.e.,a wafer transfer stop period where the main carrying mechanism 26Acarries no wafers.

[0090] Explanation is made by showing specific numerical values. If thecycle time A is 30 seconds and the dummy dispense time B is 20 seconds,since the cycle time A is longer than the dummy dispense time B, therelation of the inequality Axx<B is not established. Thus, x=0 is set,and the number of times of stopping wafer transfer (x+1) becomes 1. Ifthe number of times of stopping wafer transfer is 1, a wafer carryingrecipe of the main carrying mechanism 26A becomes similar to that shownin FIG. 10A. In the drawing, the dummy dispense is denoted by areference code DD. If the cycle time A and the dummy dispense time B areequal (A=B), since the relation of the inequality Axx<B is notestablished, the number of times of stopping wafer transfer becomes 1.

[0091] If the cycle time A is 30 seconds and the dummy dispense time Bis 40 seconds, since the cycle time A is shorter than the dummy dispensetime B, the relation of the inequality Axx<B is established. Thus, x=1is set, and the number of times of stopping wafer transfer (x+1) becomes2. If the number of times of stopping wafer transfer is 2, a wafercarrying recipe of the main carrying mechanism 26A becomes similar tothat shown in FIG. 10B.

[0092] The counting section 67 has a function of counting the number ofwafers to be processed in the processing section S1. For example, whenwafers are transferred from the auxiliary carrying mechanism 24 of thecassette station 21 to the TRS1 of the processing section S1, the numberthereof is counted by the counting section 67. Further, the dummydispense determining section 68 has a function of determining whether ornot the dummy dispense is carried out based on, for example, the numberof wafers counted by the counting section 67.

[0093] Next, description will be made of resist pattern formationcarried out by using the substrate processing device of the embodiment.

[0094] First, before a resist pattern is formed, the operator selectsthe process recipe 71, the carrying recipe 72, the pump recipe 73, andthe dummy dispense recipe 74 of a film to be formed by the recipeselecting section 63. Here, for example, if a target recipe is executionof the dummy dispense between the preceding lot A and the succeeding lotB by the coating device 4A, at the cycle time calculating section 64,the cycle time of the main carrying mechanism 26A for carrying a waferto the coating device 4A is calculated based on the process recipe 71and the carrying recipe 72 of the preceding lot A. Further, at the dummydispense time calculating section 65, the dummy dispense time B of thecoating device 4A is calculated based on the pump recipe 73 and thedummy dispense recipe 74 of the preceding lot A.

[0095] Then, at the wafer transfer stopping times calculating section66, based on the cycle time A and the dummy dispense time B of the maincarrying mechanism 26A, the number of times of stopping wafer transferfrom the cassette station 21 to the TRS1 of the processing section S1(x+1) and a wafer transfer stop period (sec.) are calculated. Forexample, a command is outputted to the controller 240 of the transferarm 24 of the cassette station 21 to stop an operation of taking outwafers from the cassette C by the calculated number of stopping timesafter the last wafer A25 of the preceding lot A is transferred to theTRS1, and to take out the first wafer B01 of the succeeding lot B andtransfer it to the TRS1.

[0096] Then, the control section 6 outputs a start command of thepreceding lot A to each section. Thus, for example, while the number ofwafers is counted by the counting section 67 when the wafers aretransferred to the TRS1 of the processing section S1 by the auxiliarycarrying mechanism 24 of the cassette station 21, the wafers are carriedby the main carrying mechanisms 26A, 26B to be subjected to apredetermined process, and it is determined whether or not the dummydispense is carried out based on the counted number.

[0097] According to the embodiment, when the preset number is counted,for example, when the last wafer A25 of the preceding lot A is counted,determination is made as to whether the dummy dispense is executed. Ifnonexecution of the dummy dispense is determined, the wafer is carriedalong the aforementioned route by the main carrying mechanisms 26A, 26Bto be subjected to a predetermined process.

[0098] If execution of the dummy dispense is determined, the controlsection 6 outputs a command to the coating device 4A, the pump P and thevalve V. When the wafer A25 is taken out from the coating device 4A, thevalve V is opened and the pump P is operated to execute the dummydispense. When the last wafer A25 of the preceding lot A is counted,based on the command from the control section 6, the auxiliary carryingmechanism 24 of the cassette station 21 stops taking out the calculatednumber of wafers, whereby the wafer transfer operation to the TRS1 ofthe processing section S1 is stopped for a predetermined period.

[0099] The first wafer B01 of the succeeding lot B is carried to theTRS1 by the auxiliary carrying mechanism 24, and then carried into theprocessing section S1 by the main carrying mechanisms 26A, 26B. When thedummy dispense is executed and the taking-out of the first wafer B01 ofthe succeeding lot B by the auxiliary carrying mechanism 24 of thecassette station 21 is stopped, the counted number is cleared. When thefirst wafer B01 of the succeeding lot B is carried to the TRS1 of theprocessing section S1, next counting is started.

[0100] Between the last wafer A25 of the preceding lot A and the firstwafer B01 of the succeeding lot B, wafer transfer from the cassettestation 21 to the TRS1 of the processing section S1 by the auxiliarycarrying mechanism 24 is not carried out for a predetermined number oftimes. During this period, the dummy dispense is executed.

[0101] As shown in FIG. 9, a period of no wafer carrying is set betweenthe process of the preceding lot A and the process of the succeeding lotB in the coating device 4A and, during this period, the dummy dispenseis executed. Accordingly, no substrate congestion occurs in theprocessing section until the dummy dispense is finished in the coatingdevice 4A. That is, a standby state of the substrates in the heatingunit disappears to enable prevention of overbaking of the resist film.

[0102] For example, if the cycle time is 30 seconds and the dummydispense time is 20 seconds, the number of times of stopping wafertransfer (x+1) becomes 1. In this case, as shown in FIG. 10A, an emptytime of not carrying one wafer is set between the wafer A25 and thewafer B01. When resist coating on the wafer A25 is finished in thecoating device 4A and the wafer A25 is carried to the TRS2 which is anext step of the coating device 4A, the wafer B01 is carried to the CPL1which is a previous step of the coating device 4A. In this state, thedummy dispense is executed in the coating device 4A. However, since thedummy dispense time is 20 seconds and the cycle time is 30 seconds, thewafer B01 of the CPL1 is carried to the coating device 4A by the maincarrying mechanism 26A after the end of the dummy dispense. Accordingly,since the wafer B01 is immediately transferred to the coating device 4Awithout being set on standby, during the dummy dispense, the wafercarrying by the substrate carrying means is smoothly executed, withoutbeing stopped, to enable improvement of throughput.

[0103] If the cycle time is 30 seconds and the dummy dispense time is 40seconds, the number of wafer transfer stopping times (x+1) becomes 2. Inthis case, as shown in FIG. 10B, an empty carrying cycle time of notcarrying two wafers is set between the wafer A25 and the wafer B01.

[0104] Depending on the kind of target film, the next step of thecoating device for executing the dummy dispense may be a heating stepfor heating the wafer. In the case of carrying wafers by theconventional method, wafer taking-out from the heating device must beset on standby until the dummy dispense is finished. Thus, in theconventional method, the wafer taking-out from the heating device isdelayed by an amount equal to the dummy dispense time, which overbakesthe resist film, which may make the resist film too thin, leading to achange in pattern line width.

[0105] However, according to the method of the present invention, whenthe dummy dispense is executed in the coating device 4A, since thetransfer of the wafer W from the auxiliary carrying mechanism 24 of thecassette station 21 to the main carrying mechanism 26A is stopped, theresist film is not overbaked by the heating device.

[0106] Next, description will be made of a flow of control processed bysoftware in the control section 6 by referring to FIGS. 11A and 11B.

[0107] First, “recipe specified resists” are registered as controlitems. In the case of sequence setting of the control items “recipespecified resists”, target resists are selected by “target resist”selecting buttons, and an operation sequence is set for all thedisplayed resists. Settable items (operating conditions) are as follows.

[0108] 1) PJ interval

[0109] 2) Minimum wafer count

[0110] 3) Execution timing (pre-PJ/post-PJ)

[0111] 4) Time interval between PJs

[0112] 5) Process recipe changing conditions (set by system parameter:valid/invalid)

[0113] In the case of registering the recipe specified resists, the PJinterval of the item 1) must always be set. The PJ time interval of theitem 4) can be set only when the execution timing is pre-PJ.

[0114] Upon completion of the registration of the control items “recipespecified resists”, PJ process programming is started in the controlsection 6 (step S1). In the PJ process programming, first, it isdetermined whether or not “execution timing” is pre-PJ (step S2). If thedetermination of step S2 is YES, before paying-out of a PJ head waferfrom a carrier (cassette) (step S3) and after the recipe registration,determination is made as to whether it is a first PJ or not (step S4).If the determination of step S2 is NO, the process proceeds tolater-described steps S21 to S26.

[0115] If the determination of step S4 is YES, the dummy dispense isexecuted in pre-PJ (step S5). If the determination of step S4 is NO, itis determined whether or not “process recipe changing condition dummydispense” is valid (step S6).

[0116] Further, it is determined whether or not a used recipe isdifferent from a PJ used immediately before (step S7). If thedetermination of step S7 is YES, the wafer carrying-in interval iscontrolled in order to execute the dummy dispense in pre-PJ (step S8).If the determination of step S7 is NO, it is further determined whetheror not a “time interval between PJs” has been set (step S9).

[0117] If the determination of step S9 is YES, it is determined whetheror not the set “time interval between PJs” is satisfied (step S10). Ifthe determination of step S10 is YES, control signals are sent to themain carrying mechanisms 26A, 26B to control operations of both, wherebythe wafer carrying-in interval is adjusted to enable execution of thedummy dispense in pre-PJ (step S11).

[0118] If the determination of steps S9, S10 are NO, it is determinedwhether or not the set “PJ interval” is satisfied (step S12). If thedetermination of step S12 is YES, it is determined whether or not a“minimum wafer count” has been set (step S13).

[0119] If the determination of step S13 is YES, it is determined whetheror not the set “minimum wafer count” is satisfied (step S14).

[0120] If the determination of step S14 is YES, control signals are sentto the main carrying mechanisms 26A, 26B to control operations of both,whereby the wafer carrying-in interval is adjusted to enable executionof the dummy dispense in pre-PJ (step S15). If the determinations ofsteps S12, S14 are NO, the dummy dispense is not executed (step S16).

[0121] If the determination of step S2 is NO, after carrying-in of a PJlast wafer from a target module (step S21), it is determined whether ornot the set “PJ interval” is satisfied (step S22). If the determinationof step S22 is YES, it is determined whether or not a “minimum wafercount” has been set (s23). Then, if the determination of step S23 isYES, it is determined whether or not the set “minimum wafer count” issatisfied (step S24). If the determination of step S24 is YES, controlsignals are sent to the main carrying mechanisms 26A, 26B to controloperations of both, whereby the wafer carrying-in interval by thecarrying mechanism 26A, 26B is adjusted to execute the dummy dispense inpre-PJ (step S25). If the determinations of steps S22, S24 are No, thedummy dispense is not executed (step S26).

[0122] As shown in FIG. 12, as functions concerning dummy dispenserecipes, there are two functions, i.e., (1) recipe editing and (2)register/clear. First, a dummy dispense recipe screen is selected on aninput operation panel to display a “list of recipes”. In the case ofrecipe editing, a new or edit button is clicked on the “recipe listdisplay” screen to display a recipe editing screen. After apredetermined editing operation, a close button or a discard and closebutton is clicked to finish the screen. In the case ofregistering/clearing, a register, clear, automatic register or automaticregistration clear button is clicked on the “recipe list display”screen.

[0123] Next, the dummy dispense recipes will be described briefly.

[0124] The operator can set “dummy dispense operation conditions”, “anoperation sequence” and “a pump recipe” in control items of modules inone dummy dispense recipe. For the modules and the control items, anecessary amount is automatically set in a recipe during new recipemaking. The operator cannot add/delete modules or control items. For therecipe specified resists (or recipe specified developing solutions), anoperation sequence and a pump recipe can be set for each resist (ordeveloper solution).

[0125] Valid control items in each module are set based the followingcriteria (i) (ii) (iii) as shown in Table 1.

[0126] (i) All dispenses which are “YES” in dispense constitutingparameters.

[0127] (ii) If one of a plurality of resists 1 to N (or nozzle

[0128]1 to N) is in (i), a “recipe specified resist (or recipe specifieddeveloper solution)” is added.

[0129] (iii) If a plurality of dummy dispense condition setting functionoptions are valid, for the resists (or developer solutions), items named“resist priority 1”, “resist priority 2”. . . “resist priority N” (N isoptionally decided) are added.

[0130] If the control item is a recipe specified resist (or recipespecified developer solution), as settable operating conditions, thereare PJ conditions (process job condition=lot condition), a minimum wafercount, execution timing, and a time interval between PJs. If theplurality of dummy dispense condition setting function options are validand the control item is a resist priority N, as settable operatingconditions, there are a time interval, and dispense during process/not.Further, if the control is other than the above, as shown in Table 1, assettable operating conditions, there are a time interval, a processedwafer count, and dispense during process/not. In the case of the recipespecified resist (or recipe specified developer solution), an operationsequence and a pump recipe can be set for each resist. TABLE 1 Controlitem Settable operating condition Recipe PJ condition, Minimum waferspecified count, Execution Timing, resist Time interval between PJsRecipe specified developer solution Resist Time interval, Dispensepriority N (*) during process/Not Other than Time interval, Processedthose above wafer count, Dispense during process/Not

[0131] Next, brief description will be made of screen constitutionswhich function as the recipe making section 61, the recipe storingsection 62 and the recipe selecting section 63 of the control section.

[0132] The dummy dispense recipe list screen (not shown) functions asthe recipe storing section 62, where a number of selecting buttons suchas edit, new, register, clear, automatic register, automaticregistration clear, delete, and close are displayed. By selecting the“edit” button on the list screen, a “dummy dispense recipe edit screen”shown in FIG. 13 is displayed on the input operation panel.

[0133] The dummy dispense recipe editing screen functions as the recipemaking section 61, and it displays a select module display section (1),a recipe specified resist list (2), a select module selecting button(3), a device constitutional view selecting button (4), a PJ intervalselecting button (5), a time interval selecting button (6), a processedwafer count selecting button (7), a PJ interval selecting button (8), aselecting button not using minimum wafer count (9), an execution timingPJ head selecting button (10), a PJ time interval (30 sec.) selectingbutton (11), a sequence setting button (12), a closing button (13), adiscarding and closing button (14), a saving button (15), a headerinformation button (6), a copying button (17), a valid/invalid button(18), an invalid item display button (19), and other buttons.

[0134] The display sections (1) and (2) in FIG. 13 are for easierunderstanding of the screen by the operator, and these displays cannotbe freely added/deleted by the operator. The button (3) is used toswitch a select module displayed in the display section (1). When thescreen button (4) is selected, the screen is switched to the deviceconstitutional view. The screen of the device constitutional view (notshown) functions as the recipe making section 61, and it is used whenthe operator switches the select module.

[0135] A group of buttons (5) to (12) of FIG. 13 is used to edit dummydispense operating conditions. Among these, the group of the buttons (5)to (7) and the group of the buttons (8) to (11) are selectively switchedto be displayed on the screen. The former is displayed on the screenwhen a cursor is set on a control item other than the recipe specifiedresist, while the latter is displayed on the screen when the cursor isset on the recipe specified resist (or recipe specified developersolution).

[0136] When these buttons (5) to (12) are selected, functions indicatedby Nos. 1 to 8 in Table 2 are displayed on the screen. For example, ifthe button (12) is selected, a dummy dispense operation sequence settingscreen shown in FIG. 14 appears. On this screen, by switchingdeletion/insertion and validity/invalidity of steps, each dummy dispensetime (sec.) can be set for each resist system. A dummy dispense systemnumber is displayed in No. 1 of the screen, the dummy dispense time(sec.) is displayed in No. 3, a dummy dispense system number isdisplayed in No. 4, and a dummy dispense system number, a dummy dispensename, a pump recipe name are displayed together in No. 5.

[0137] For example, when the No. 4 function button of the screen shownin FIG. 14 is selected, a dummy dispense selection screen (not shown)appears. This dummy dispense selection screen functions as the recipeselecting section 63, and it is used to select and set a resist nozzleand a solvent nozzle.

[0138] When the No. 5 function button of the dummy dispense operationsequence setting screen is selected, a pump recipe selection screen (notshown) appears. This pump recipe selection screen functions as therecipe selecting section 63, and it is used to select and set a dummydispense amount and a pump. TABLE 2 No. Function 1 Sets Time intervalcondition for the selected control item 2 Sets Processed wafer countcondition for the selected control item 3 Sets Dispense during processfor the selected control item (Exec/Not) 4 Sets PJ count for theselected control item 5 Sets Minimum wafer count for the selectedcontrol item 6 Sets Execution timing for the selected control item (Notspecified/ Pre-PJ/Post-PJ) 7 Sets Time interval between PJs for theselected control item 8 Displays Executing sequence set screen

[0139] A Group of buttons (13) to (19) in FIG. 13 are function buttons.When these function buttons (13) to (19) are selected, functionsindicated by Nos. 1 to 7 in Table 3 appear on the screen. For example,if the button (17) is selected, a copying screen (not shown) isdisplayed. The copying screen functions as the recipe making section 61,where a module having a control item similar to that at a copying originis displayed as a choice to be copied. Thus, the item similar to thecontrol item at the copying origin can be duplicated as the control itemto be copied. TABLE 3 No. Function 1 Saves the recipe and closes theedit screen 2 Closes the edit screen without saving the recipe 3 Savesthe recipe 4 Displays the header information screen that includescomments. 5 Displays the copy screen 6 Changes the validity of theselected control item 7 Changes the display/nondisplay of invalid items.Nondisplay does not show the item that is “Not use”.

[0140] An option screen (not shown) is used to set a plurality of dummydispense conditions for one resist. For example, for each specifiedresist, “a resist name”, “a dummy dispense time interval”, and“possibility of execution in process” are displayed. A dummy dispenseoperation sequence setting screen (not shown) is called from the optionscreen to set multi-dummy dispense conditions.

[0141] As described above, according to the method of the presentinvention, when it is determined that the dummy dispense is executed inthe coating device 4A, or execution of the dummy dispense is predicted,the transfer of the first wafer B01 of the succeeding lot from thecassette station 21 to the TRS1 of the processing section S1 is stoppedto set a predetermined time interval for the dummy dispense between thepreceding lot and the succeeding lot.

[0142] Determination as to whether or not the dummy dispense is executedmay be made by counting the number of processed wafers based on thestored recipes including the prediction of the operator, or by countinga processing time.

[0143] The control section 6 may detect a step in which the last waferA25 of the preceding lot is present, and it may be determined whether ornot the dummy dispense is executed based on the detection result.

[0144] Further, recognition of the last wafer A25 of the preceding lotand the head wafer B01 of the succeeding lot may be made by directlycounting the number of wafers. A step in which the wafer is present maybe checked by the control section 6. Incidentally, a wafer countingplace is not limited to the TRS1 of the processing section S1, and itmay be the cassette C of the cassette station 21.

[0145] Here, the timing for the dummy dispense executed in the solutionprocessing device is at processing of the set number of lots, at theprocessing recipe change timing, when a time from the succeeding lot toa start of the succeeding lot is a predetermined interval or more, ateach set time, and when the set number (e.g., 100) is processed.

[0146] A target of the dummy dispense is not limited to the coatingdevice 4A, and the developing device 4B and an adhesion unit areincluded. In the case of executing the dummy dispense in the developingdevice 4B, the auxiliary carrying mechanism 31 of the first interfacesection S2 is equivalent to the transfer mechanism of the presentinvention, the out-buffer cassette of the first interface section S2 isequivalent to the cassette of the invention, and the PEB of theprocessing section S1 is equivalent to the transfer section of theinvention.

[0147] In the case of the dummy dispense executed at a plurality ofunits for carrying by common substrate carrying means, a longer time isset for the dummy dispense, and a wafer transfer stop period (number ofempty carrying cycle times) is decided based on this dummy dispense timeand the cycle time of the main carrying mechanisms.

[0148] The operator may directly enter the cycle time and the dummydispense time to the recipe making section 61. The operator may predictthe dummy dispense time of the solution processing device to decide atransfer stop period of the first substrate of the succeeding lot to themain carrying mechanisms.

[0149] Further, the main carrying mechanisms may directly take out thewafer from the cassette. In this case, during the dummy dispense, theoperations of the main carrying mechanisms are controlled to stop thetaking-out of the first wafer of the succeeding lot. Additionally, thenumber of main carrying mechanisms is not limited to two, but it may bethree or more, or even one.

[0150] According to the present invention, in the case of executing thedummy dispense in the solution processing device, since the transfer ofthe substrates from the cassette section to the processing section isstopped for the predetermined period, no substrates stay in theprocessing section, which enables prevention of overbaking of the resistfilm by, for example, the heating device.

What is claimed is:
 1. A substrate processing method which comprises transferring substrates one by one from a cassette section to a processing section by a transfer mechanism at a timing of each predetermined cycle time, the cassette section having a cassette which houses the plurality of substrates constituting lots, the processing section including a plurality of solution processing units and a plurality of substrate carrying mechanisms; carrying the substrates in sequence along a cyclic route of the processing section by the substrate carrying mechanisms; executing a plurality of processes for the substrates in sequence; carrying the processed substrates from the processing section to the cassette section; and executing dummy dispense by at least one of the solution processing units in a period between a process of a preceding lot substrate and a process of a succeeding lot substrate, the method comprising: stopping the transfer of a head substrate of the succeeding lot for a period which is an integral multiple of the cycle time, after a last substrate of the preceding lot is transferred from the cassette section to the processing section by the transfer mechanism; executing the dummy dispense of a predetermined dummy dispense time by the solution processing unit during the substrate transfer stop period; and transferring the head substrate of the succeeding lot to the processing section by the transfer mechanism after the dummy dispense.
 2. The method according to claim 1, further comprising: making a recipe to control an operation of each of the transfer mechanism, the substrate carrying mechanisms and the solution processing units and a recipe to define initial conditions; storing the made recipes; selecting the necessary recipe from the stored recipes; setting the cycle time and the dummy dispense time based on the selected recipe; obtaining the substrate transfer stop period based on the cycle time and the dummy dispense time; and controlling operations of the transfer mechanism, the substrate carrying mechanisms and the solution processing units by using the substrate transfer stop period, the cycle time and the dummy dispense time, thereby causing at least one of the solution processing units to execute the dummy dispense during the substrate transfer stop period.
 3. The method according to claim 2, wherein the dummy dispense time is predicted based on the stored recipes, and the substrate transfer stop period is decided based on the predicted dummy dispense time and the cycle time.
 4. The method according to claim 2, further comprising: counting the number of the processed substrates; deciding execution timing of the dummy dispense based on the counted number of the processed substrates and the recipes; and executing the dummy dispense at the decided execution timing by the solution processing unit.
 5. The method according to claim 4, wherein the number of the continuously processed substrates after the previous dummy dispense is counted, and based on the counted number, it is determined whether or not the next dummy dispense is executed.
 6. The method according to claim 5, wherein the number of the continuously processed substrates is counted at the processing section or the cassette section.
 7. The method according to claim 4, wherein a continuous processing time of the substrates is counted after the previous dummy dispense, and based on the counted time, it is determined whether or not the next dummy dispense is executed.
 8. The method according to claim 1, further comprising: detecting a place of the last substrate of the preceding lot in the processing section; and determining whether or not the next dummy dispense is executed based on a result of the detection.
 9. The method according to claim 8, wherein in order to detect a step in which the last substrate of the preceding lot and the head substrate of the succeeding lot are present, the substrates actually flowing in the processing section are counted, and based on a result of the counting, it is determined whether or not the next dummy dispense is executed.
 10. The method according to claim 2, further comprising: selecting and calling a time interval between lots from the stored recipes; deciding the execution timing of the dummy dispense based on the time interval between lots and the recipes; and executing the dummy dispense by the solution processing unit at the execution timing.
 11. The method according to claim 2, further comprising: selecting and calling a minimum wafer count from the stored recipes; deciding the execution timing of the dummy dispense based on the minimum wafer count and the recipe; and executing the dummy dispense by the solution processing unit at the execution timing.
 12. The method according to claim 2, further comprising: selecting and calling a process recipe change timing from the stored recipes; deciding the execution timing of the dummy dispense based on the process recipe change timing; and executing the dummy dispense by the solution processing unit at the execution timing.
 13. The method according to claim 1, wherein the cycle time is from transfer of an n-th substrate in the cassette from the transfer mechanism to the substrate carrying mechanisms to transfer of a next (n+1)-th substrate in the cassette from the transfer mechanism to the substrate carrying mechanisms.
 14. The method according to claim 1, wherein the cycle time is equivalent to one round of each of the substrate carrying mechanisms along the cyclic route.
 15. A substrate processing device comprising: a cassette section from and into which a cassette housing a plurality of substrates constituting lots is taken and put; a processing section to execute a plurality of processes for the substrates in sequence; a plurality of solution processing units disposed in the processing section to process the substrates by using a predetermined processing solution; a transfer mechanism to take out the substrates from the cassette of the cassette section and to transfer the substrates to the processing section; substrate carrying mechanisms to receive the substrates from the transfer mechanism, to carry the substrates in sequence in the processing section, and to carry the substrates out to the cassette section; a cyclic route disposed in the processing section, along which the substrate carrying mechanisms make cycle movements; and a control section to make recipes which define operations of the transfer mechanism, the substrate carrying mechanisms and the solution processing units, to obtain a cycle time and a dummy dispense time based on the recipes, to obtain a substrate transfer stop period based on the recipes, the cycle time and the dummy dispense time, to stop transfer of a substrate of a succeeding lot from the cassette section to the processing section during the substrate transfer stop period, to cause the solution processing unit to execute dummy dispense during the substrate transfer stop period, and then to transfer the substrate of the succeeding lot to the processing section by the transfer mechanism.
 16. The device according to claim 15, wherein the control section comprises: a recipe making section to make a recipe to define an operation of each of the transfer mechanism, the substrate carrying mechanisms and the solution processing units; a recipe storing section to store the recipes made by the recipe making section; a recipe selecting section to select and call the recipes stored in the recipe storing section; a cycle time calculating section to calculate the cycle time based on the recipes; a dummy dispense calculating section to calculate the dummy dispense time based on the recipes; a transfer stop period calculating section to calculate the substrate transfer stop period based on the recipes, the cycle time and the dummy dispense time; a counting section to count the number of the processed substrates; and a dummy dispense determining section to decide the execution timing of the dummy dispense based on the counted number of the processed substrates and the transfer stop period.
 17. The device according to claim 16, wherein the dummy dispense determining section obtains a time interval between lots based on the recipes, and decides the execution timing of the dummy dispense based on the time interval between lots.
 18. The device according to claim 16, wherein the dummy dispense determining section obtains a minimum wafer count based on the recipes, and decides the execution timing of the dummy dispense based on the minimum wafer count.
 19. The device according to claim 16, wherein the dummy dispense determination section obtains a process recipe change timing based on the recipes, and decides the execution timing of the dummy dispense based on the process recipe change timing.
 20. The device according to claim 16, wherein the dummy dispense determining section counts the number of the continuously processed substrates after the previous dummy dispense, and determines whether or not the next dummy dispense is executed based on the counted number. 